https://www.selleckchem.com/products/conteltinib-ct-707.html Laser-based fabrication can be an alternative technology to mechanical grinding and polishing processes. However, the performance of these elements in real applications still needs to be validated. In this paper, we demonstrate that the subtractive fabrication technology is able to produce high-quality axicons from fused silica, which can be efficiently used for glass processing. We comprehensively investigate axicons, fabricated by ultrashort pulsed laser ablation with subsequent CO2 laser polishing, and compare their performance with commercially available axicons. We show that laser-fabricated axicons are comparable in quality with a precision commercial axicon. Furthermore, we demonstrate the intra-volume glass modification and dicing, utilising mJ-level laser pulses. We show that the tilting operation of the laser-fabricated axicons results in the formation of directional transverse cracks, which significantly enhance the 1 mm-thick glass dicing process.We demonstrate a 200G capable WDM O-band optical transceiver comprising a 4-element array of Silicon Photonics ring modulators (RM) and Ge photodiodes (PD) co-packaged with a SiGe BiCMOS integrated driver and a SiGe transimpedance amplifier (TIA) chip. A 4×50 Gb/s data modulation experiment revealed an average extinction ratio (ER) of 3.17 dB, with the transmitter exhibiting a total energy efficiency of 2 pJ/bit. Data reception has been experimentally validated at 50 Gb/s per lane, achieving an interpolated 10E-12 bit error rate (BER) for an input optical modulation amplitude (OMA) of -9.5 dBm and a power efficiency of 2.2 pJ/bit, yielding a total power efficiency of 4.2 pJ/bit for the transceiver, including heater tuning requirements. This electro-optic subassembly provides the highest aggregate data-rate among O-band RM-based silicon photonic transceiver implementations, highlighting its potential for next generation WDM Ethernet transceivers.Here, w