https://www.selleckchem.com/products/a-1155463.html An estimated global safety factor of 3.67 showed the high safety, reliability and robustness of the novel connection system. The study discusses the structural performance of the proposed connection system, demonstrating its technical suitability.The Cu-1.7Ni-1.4Co-0.65Si (wt%) alloy is hot compressed by a Gleeble-1500D machine under a temperature range of 760 to 970 °C and a strain rate range of 0.01 to 10 s-1. The flow stress increases with the extension of strain rate and decreases with the rising of deformation temperature. The dynamic recrystallization behavior happens during the hot compression deformation process. The hot deformation activation energy of the alloy can be calculated as 468.5 kJ/mol, and the high temperature deformation constitutive equation is confirmed. The hot processing map of the alloy is established on the basis of hot deformation behavior and hot working characteristics. With the optimal thermal deformation conditions of 940 to 970 °C and 0.01 to 10 s-1, the fine equiaxed grain and no holes are found in the matrix, which can provide significant guidance for hot deformation processing technology of Cu-Ni-Co-Si alloy.Marine fungi have been studied since the first record of the species Sphaeria posidoniae (Halotthiaposidoniae) on the rhizome of the sea grass Posidonia oceanica by Durieu and Montagne in 1846 [1], butthey have largely been neglected, even though it is estimated that there are greater than 10,000 marinefungal species [...].The influence of surface bulges and cavities within metals is an important metallurgical-mechanical problem that has not been fully solved and motivates multiple discussions. This is not only related to the generation of interfaces, but also to the distribution of alloying components and elements. In this study, Laplace's equation was used to develop a set of equations to describe these kinds of defects in plates, which arise during the development of metal